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Funded Projects

Completed 유연 물리센서 통합을 위한 신축성 인터커넥션 PCB 기술 개발(Development of stretchable interconnection PCB technology for integration of elastic physical sensors)

본문

Funder
KAIST (2017M3C1B2085318)
Period
2017.09.01-2019.08.31
Category
Completed