At KAIST Development of Highly Stretchable Printed Circuit Board towards Reliable Integration of Electric Components 본문 Author M. Kim, S. Kim, K. Kim, H. Lim, and I. Park Conference 2018 MRS Fall Meeting Location Boston, USA Period Nov 2018 목록 이전글Wearable soft microfluidic pressure sensor using 3D-printed microbump for health monitoring 24.12.02 다음글Highly Sensitive and Robust Soft Pressure Sensor using 3D-structured Microchannel and Liquid Metal for Wearable Applications 24.12.02