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International Conference

At KAIST Universal stretchable electronic circuit board with hermetically sealed liquid metal interconnection and strain-controllable polymeric substrate

본문

Author
Minseong Kim, Jungrak Choi, Yung Lee, Seonggi Kim, Byeong-Soo Bae, Hyuneui Lim, Inkyu Park
Conference
ICAE 2021
Location
Jeju, South Korea
Period
Nov 2021