At KAIST Highly Sensitive and Robust Soft Pressure Sensor using 3D-structured Microchannel and Liquid Metal for Wearable Applications 본문 Author K. Kim, Y. Jeong, J. Park, M. Kim, Y. Oh, and I. Park Conference 2018 MRS Fall Meeting Location Boston, USA Period Nov 2018 목록 이전글Development of Highly Stretchable Printed Circuit Board towards Reliable Integration of Electric Components 24.12.02 다음글Soft micro/ nano-composite materials for flexible/wearable physical sensors 24.12.02