"Interfacial toughening of solution processed Ag nanoparticle films using organic residuals(용액공정 기반 은 나노입자 박막의 유기 잔여물에 의한 계면 접합 강화)"
Sanghyeok Kim, Inhwa Lee, Jeonghoon Yun, Taek-Soo Kim and Inkyu Park
The Korean Society of Mechanical Engineers Conference(대한기계학회 춘계학술대회),
Daejeon, May 2012