반도체 패키지 및 반도체 패키지의 제조방법
본문
SUBSTRATE PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Inventors
- Inkyu Park, Cheolmin Kim, Hyunseok Han, Taejae Park, Chaein Moon, Seoncheol Kim
- Country
- United States of America
- Patent Information
- Patent Application 19/020,127, registration in progress